Process Development Engineer, Thin Films

At Wolfspeed, we do amazing things in a human way.

We know that the achievements of our organization are due to the passion, hard work and creativity of our employees. We celebrate different perspectives to foster excellence across our organization, and our goal is to make diversity a foundation of what we do. We are proudly building an environment where you can bring your authentic self to work.

• Enjoy doing things that people say can’t be done? Innovation is at the center of everything we do.
• Hate red tape? We remove roadblocks instead of creating them.
• Working parent? We provide paid parental leave.
• Student? We offer continuing education assistance.
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Here’s the Gist

To extend our global leadership in silicon carbide technologies, we currently have a need for a Process Development Engineer- Thin Films within the Power Semiconductor Device R&D Process Development Group. As a Process Development Engineer in the Power R&D group, you will drive the development of novel process capabilities that will advance Wolfspeed’s SiC power device technology. We are looking for a highly motivated candidate with a strong track record of innovation and ingenuity. This position will be based in the Mohawk Valley Fab, with periodic travel to headquarters in NC.

The Day-to-Day

• Lead the development and improvement of dielectric and metal thin films processes to drive the development of next generation power semiconductor devices, enhance product performance, and improve product yields
• Spearhead collaborations with the R&D design and integration teams to create unit processes to meet Automotive customer specifications
• Own the creation of operation specifications for new production processes and equipment
• Provide technical process development leadership
• Drive innovation and continuous improvement in a fast-paced, dynamic environment

This Job is Right for You if You Have (Minimum Requirements)

• Ph.D. degree in Chemistry, Materials Science, Chemical Engineering, Physics, or any closely related engineering field.
• Strong understanding of semiconductor device fabrication
• Experience in process integration or process development in a semiconductor fab or lab environment.
• Exceptional knowledge of various thin film deposition techniques, such as PVD (DC and RF), PECVD, MOCVD, LPCVD, ALD, and SACVD
• Working knowledge of material characterization techniques, such as SEM, ellipsometry, AFM, XRF and/or other similar techniques
• Experience with SPC and DOE methodology
• Excellent communication and presentation skills

This role may require additional duties and/or assignments as designated by management.

To put it legally – Wolfspeed is an equal opportunity employer.

We recruit, employ, train, compensate and promote regardless of race, sex, religion, color, national origin, disability, age, veteran status, gender identity, sexual orientation and other protected status as required by law.

The posted salary range is what Wolfspeed reasonably expects to pay for this position. Actual pay for a hired applicant will be determined based on the individual’s job-relevant qualifications, experience, and other determinative factors. In the event it is determined that a different job level upon hire is warranted then that range will be communicated to the hired applicant as soon as reasonably practicable.

Compensation Range:

$102,000.00 - $140,000.00

We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.